Heat insulating module for a high temperature chamber

Disclosed is a heat insulating module for use in forming a lining for a high temperature chamber. The module has a main body formed by a blanket of refractory fibers folded into pleats held compressed against one another by a pair of spaced apart tubular members traversing the opposite end portions of all except the two end layers and spaced inwardly near the cold face of the module. The ends of the tubular members are secured to the upright legs of respective L-shaped mounting members with the other legs thereof lying in a common plane generally parallel to the cold face of the module and anchorable to respective fastener studs securable to the wall of the chamber being insulated.