Positive resist material

The invention relates to positive resist materials of thermally crosslinkable methacrylic polymers soluble in organic solvents, which are characterized in that the methacrylic polymers are copolymers of 80 to 98 mol-% of fluoroalkylmethacrylate and 20 to 2 mol-% of methacrylic acid chloride or chlor...

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Bibliographische Detailangaben
Hauptverfasser:	SOTOBAYASHI, HIDETO, SCHNABEL, WOLFRAM, ASMUSSEN, FRITHJOF, CHEN, JIANG-TSUN
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The invention relates to positive resist materials of thermally crosslinkable methacrylic polymers soluble in organic solvents, which are characterized in that the methacrylic polymers are copolymers of 80 to 98 mol-% of fluoroalkylmethacrylate and 20 to 2 mol-% of methacrylic acid chloride or chloroalkylmethacrylate. The resists of the invention are very well suited for the transfer of microstructures, for example in semiconductor technology. They have, in addition to a high sensitivity, a very good mechanical stability and strength of adhesion.