Process for using a flexible laminatable photosensitive layer in the production of a printed circuit

Disclosed is a flexible photosensitive layer containing a polymeric binder, which is capable of being laminated and is applied to a preferably flexible support. The photosensitive layer comprises a photoconductor layer composed of a substantially organic photoconductor, the binder, a sensitizer and/...

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Bibliographische Detailangaben
Hauptverfasser:	BRECHLIN, ALFRED
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY ELECTROPHOTOGRAPHY HOLOGRAPHY MAGNETOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PHOTOGRAPHY PHYSICS POLISHES PRINTED CIRCUITS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Disclosed is a flexible photosensitive layer containing a polymeric binder, which is capable of being laminated and is applied to a preferably flexible support. The photosensitive layer comprises a photoconductor layer composed of a substantially organic photoconductor, the binder, a sensitizer and/or activator, in which the binder comprises at least one copolymer having repeating units of the general formula Wherein R1 denotes and R2 denotes H or -CH3.