Preparation of organic layers for oxygen etching

An improved method of etching a layer of organic material on a sustrate by oxygen plasma or oxygen reactive ion etching is disclosed. The surface of the layer is flood exposed with a plasma including a fluorine species for a time sufficient to significantly reduce the etch rate thereof in the oxygen...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WHITE, LAWRENCE K, POPOV, METODI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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