Metal-semiconductor resistive ribbon for thermal transfer printing and method for using

A resistive ribbon for thermal transfer printing comprising a support layer bearing a fusible ink composition and a thin aluminum layer upon which is deposited a resistive layer of non-stoichiometric metal silicide is disclosed. Also disclosed are appropriate power sources for using the resistive ri...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	AVIRAM, ARI, SHIH, KWANG K
Format:	Patent
Sprache:	eng
Schlagworte:	COLOUR PRINTING CORRECTION OF TYPOGRAPHICAL ERRORS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A resistive ribbon for thermal transfer printing comprising a support layer bearing a fusible ink composition and a thin aluminum layer upon which is deposited a resistive layer of non-stoichiometric metal silicide is disclosed. Also disclosed are appropriate power sources for using the resistive ribbon, as well as methods for non-impact printing employing the disclosed ribbon.