Fast setting adhesive composition

The invention provides an adhesive composition of the two-part separate application type comprising solutions A and B. The solution A is an aqueous solution of a high polymer having an amide bond or an imide bond within the molecule, or an aqueous dispersion obtained by adding a rubber latex and/or...

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Bibliographische Detailangaben
Hauptverfasser: UCHIDA, TOMIO, OKITSU, TOSHINAO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The invention provides an adhesive composition of the two-part separate application type comprising solutions A and B. The solution A is an aqueous solution of a high polymer having an amide bond or an imide bond within the molecule, or an aqueous dispersion obtained by adding a rubber latex and/or synthetic resin emulsion to the aqueous solution of the high polymer. The solution B is an aqueous solution of a dialdehyde compound, or an aqueous solution or dispersion obtained by adding a crosslinking agent for crosslinking the high polymer of the solution A to the aqueous solution of the dialdehyde compound.