Fast setting adhesive composition
The invention provides an adhesive composition of the two-part separate application type comprising solutions A and B. The solution A is an aqueous solution of a high polymer having an amide bond or an imide bond within the molecule, or an aqueous dispersion obtained by adding a rubber latex and/or...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The invention provides an adhesive composition of the two-part separate application type comprising solutions A and B. The solution A is an aqueous solution of a high polymer having an amide bond or an imide bond within the molecule, or an aqueous dispersion obtained by adding a rubber latex and/or synthetic resin emulsion to the aqueous solution of the high polymer. The solution B is an aqueous solution of a dialdehyde compound, or an aqueous solution or dispersion obtained by adding a crosslinking agent for crosslinking the high polymer of the solution A to the aqueous solution of the dialdehyde compound. |
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