Method of encapsulation

A method of encapsulating a substrate, especially a splice in a telephone cable, comprises (1) preparing an assembly comprising the substrate; an enclosure, preferably a heat-shrinkable enclosure, around the substrate; sealing material within the enclosure; and a heater within the enclosure; and (2)...

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Bibliographische Detailangaben
Hauptverfasser:	DIAZ, STEPHEN H, HORSMA, DAVID A
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRICITY GENERATION INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A method of encapsulating a substrate, especially a splice in a telephone cable, comprises (1) preparing an assembly comprising the substrate; an enclosure, preferably a heat-shrinkable enclosure, around the substrate; sealing material within the enclosure; and a heater within the enclosure; and (2) using said heater to change the viscosity of the sealing material. Preferably the heater is a PTC heater, especially one which is attached to thermoplastic sealing material in the form of a sheet or tape. In this way a desired distribution of heat through the assembly can be obtained so that extended heating times can be used.