Integrated circuit carrier

A one-piece integrated circuit carrier includes a base having a central opening bounded on opposite ends by walls having a plurality of narrow grooves for receiving the leads of an integrated circuit flat pack inserted in the carrier. Resilient retaining fingers at the corners of the central opening extend diagonally into the opening. The tips of the fingers have flanges adapted to fit over the outermost leads of the flat pack. Opposite bottom edges of the flat pack rest on a pair of ridges extending along opposite sides of the opening between the end walls of the carrier. The flat pack is inserted in the carrier by first pushing upwardly on the bottoms of the resilient retaining fingers with a set of vertical pins to spread the fingers apart sufficiently to allow the body of the flat pack to be inserted in the opening, with the outermost leads of the flat pack bypassing the fingers so the leads can be inserted in the grooves at opposite ends of the opening. Upon release of the applied vertical force, the retaining fingers return to their normal position in which the flanges at the tips of the fingers extend over the tops of the outermost leads to retain the flat pack in the carrier. Advantages are provided in retaining the flat pack by contact with the leads rather than the body of the flat pack.