Method of fabricating buried contacts

A novel method for forming a buried contact wherein the area of the buried contact is preconditioned by being doped to thus preclude the formation of an undesirable junction surrounding the buried contact.

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Bibliographische Detailangaben
Hauptverfasser:	BLUMENFELD, MARTIN A
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	A novel method for forming a buried contact wherein the area of the buried contact is preconditioned by being doped to thus preclude the formation of an undesirable junction surrounding the buried contact.