Chemical copper-plating bath

There is presented a chemical copper-plating bath capable of providing a plated film having excellent mechanical characteristics, especially ductility, which bath contains a specific additive having the following formula: Stability of the bath as well as further improvement of mechanical strength of...

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Bibliographische Detailangaben
Hauptverfasser:	HONMA, HIDEO, TAKAMURA, TSUTOMU, SASABE, TOSHIKI, SASAKI, OSAMU, IKARI, KUNIHIRO, TAKEDA, KAZUHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	There is presented a chemical copper-plating bath capable of providing a plated film having excellent mechanical characteristics, especially ductility, which bath contains a specific additive having the following formula: Stability of the bath as well as further improvement of mechanical strength of plated films are also found to be attained by adding in combination at least one compound selected from the group consisting of 1,10-phenanthroline, its derivatives, 2,2'-dipyridyl, 2,2'-diquinoline and water-soluble cyanides.