Method for soldering leads to electrical components

A method is disclosed for soldering leads to electrical components such as capacitors on which a thin contacting layer of solder metal is provided. The leads are soldered on by pressing them into the contact layer by means of two electrodes. The leads are heated by a current which flows between the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KRAUS, HUBERT
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A method is disclosed for soldering leads to electrical components such as capacitors on which a thin contacting layer of solder metal is provided. The leads are soldered on by pressing them into the contact layer by means of two electrodes. The leads are heated by a current which flows between the electrodes. In order to save material, the leads are contacted by the electrodes along the entire extent to be sealed in to heat them uniformly and to press them into the contact layer. This method is suitable for contacting capacitors whose dielectrics consist of synthetic films and whose coatings consist of regenerable thin metalizations.