Method for continuous deposition by vacuum evaporation

An apparatus to deposit material on a substrate, such as in the making of thin film solar cells, consists of two chambers. A manifold chamber having a plurality of spaced nozzles assures efficient and uniform deposition on a substrate. The rate of depositions is controlled by an orifice in a passage...

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Bibliographische Detailangaben
Hauptverfasser:	RUSSELL, T. W. FRASER, BARON, BILL N, ROCHELEAU, RICHARD E
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	An apparatus to deposit material on a substrate, such as in the making of thin film solar cells, consists of two chambers. A manifold chamber having a plurality of spaced nozzles assures efficient and uniform deposition on a substrate. The rate of depositions is controlled by an orifice in a passageway connecting the manifold chamber to an evaporation chamber.