Method of forming printed circuit

Method of forming printed circuit

A printed circuit is formed by a coating the entire region of at least one main surface of an insulating substrate with a resin type adhesive layer containing a solid solution consisting of titanium oxide, nickel oxide and antimony oxide, followed by selectively forming a mask on the adhesive layer...

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Hauptverfasser: IKARI, KUNIHIRO, TAKEDA, KAZUHIRO, TAKAHASHI, KATSUHIRO
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator IKARI
KUNIHIRO
TAKEDA
KAZUHIRO
TAKAHASHI
KATSUHIRO
description A printed circuit is formed by a coating the entire region of at least one main surface of an insulating substrate with a resin type adhesive layer containing a solid solution consisting of titanium oxide, nickel oxide and antimony oxide, followed by selectively forming a mask on the adhesive layer to provide the non-masked region as a circuit-forming region. Further, the circuit-forming region is treated with a solution of an oxidizing agent and, then, subjected to an activation treatment. Finally, the mask is removed and a desired conductive layer pattern is formed on the activated surface region by means of electroless plating.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Method of forming printed circuit
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