Method of forming printed circuit

A printed circuit is formed by a coating the entire region of at least one main surface of an insulating substrate with a resin type adhesive layer containing a solid solution consisting of titanium oxide, nickel oxide and antimony oxide, followed by selectively forming a mask on the adhesive layer...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: IKARI, KUNIHIRO, TAKEDA, KAZUHIRO, TAKAHASHI, KATSUHIRO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A printed circuit is formed by a coating the entire region of at least one main surface of an insulating substrate with a resin type adhesive layer containing a solid solution consisting of titanium oxide, nickel oxide and antimony oxide, followed by selectively forming a mask on the adhesive layer to provide the non-masked region as a circuit-forming region. Further, the circuit-forming region is treated with a solution of an oxidizing agent and, then, subjected to an activation treatment. Finally, the mask is removed and a desired conductive layer pattern is formed on the activated surface region by means of electroless plating.