Compound spring contact
An improved contact is disclosed for use in zero insertion force connectors. The subject contact is a compound spring formed from a single piece of metal stock, a portion of which is skived to achieve dual thickness stock. The contact is formed as a compound beam such that the loading thereof provid...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | An improved contact is disclosed for use in zero insertion force connectors. The subject contact is a compound spring formed from a single piece of metal stock, a portion of which is skived to achieve dual thickness stock. The contact is formed as a compound beam such that the loading thereof provides differential deflection of the contact so that a wiping action is performed at a point of engagement with a circuit board. |
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