Low dissipation factor epoxy coating powder

A coating powder is disclosed which is prepared from a solventless non-aqueous composition of a solid epoxy resin having an epoxy equivalent weight of about 400 to about 8000, a Durran's softening point of at least 70 DEG , a solid polyanhydride curing agent at least about 50 mole % of which is...

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Bibliographische Detailangaben
Hauptverfasser:	SAUNDERS, HOWARD E, SMITH, JAMES D
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CABLES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CONDUCTORS CORRECTING FLUIDS DYES ELECTRICITY FILLING PASTES INKS INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SPRAYING OR ATOMISING IN GENERAL THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	A coating powder is disclosed which is prepared from a solventless non-aqueous composition of a solid epoxy resin having an epoxy equivalent weight of about 400 to about 8000, a Durran's softening point of at least 70 DEG , a solid polyanhydride curing agent at least about 50 mole % of which is trimellitic anhydride, and a cross-linking agent having the general formula R3SnX where each R is selected from alkyl, aryl, aralkyl, and alkaryl up to C20 and X is selected from acetate, propionate, butyrate, halogen, and hydroxyl. The composition is dry-blended and then melt-mixed at 50 DEG to 150 DEG C. To prepare the coating powder, it is then cooled, crushed, and ground to a particle size of less than 100 microns. The coating powder is electrostatically applied to a conductor and is cured above the melting point of the resin.