Apparatus for joining fusible elements
An apparatus is provided for joining first and second fusible elements. The apparatus includes apparatus for controllably heating the first element to a temperature sufficient for forming a bond with the second element and apparatus for controllably moving the heating apparatus relative to the first...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | An apparatus is provided for joining first and second fusible elements. The apparatus includes apparatus for controllably heating the first element to a temperature sufficient for forming a bond with the second element and apparatus for controllably moving the heating apparatus relative to the first element. |
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