Apparatus for joining fusible elements

An apparatus is provided for joining first and second fusible elements. The apparatus includes apparatus for controllably heating the first element to a temperature sufficient for forming a bond with the second element and apparatus for controllably moving the heating apparatus relative to the first...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: OSTROWSKI, RICHARD C, STYOORN, JOHN
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:An apparatus is provided for joining first and second fusible elements. The apparatus includes apparatus for controllably heating the first element to a temperature sufficient for forming a bond with the second element and apparatus for controllably moving the heating apparatus relative to the first element.