Cathode sputtering apparatus

Methods and apparatus for depositing a coating material on an underlying substrate are disclosed. Cathode sputtering techniques for rapidly depositing a relatively thick coating on a substrate having a complex geometry are developed. The apparatus employed includes a sputtering chamber formed betwee...

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Bibliographische Detailangaben
Hauptverfasser:	WRIGHT, ROBERT JOSEPH, MULLALY, JAMES ROY, HECHT, RALPH JULIUS
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TOTRANSPORTATION COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	Methods and apparatus for depositing a coating material on an underlying substrate are disclosed. Cathode sputtering techniques for rapidly depositing a relatively thick coating on a substrate having a complex geometry are developed. The apparatus employed includes a sputtering chamber formed between a center, post cathode and a hollow, cylindrical cathode. In one embodiment a magnetic field is imposed upon the sputtering chamber to concentrate the sputtered coating material in a preferred region.