Method and apparatus for improving packaging density of discrete electronic components
A method for increasing the packaging density of discrete electronic components. The components are mounted to a flexible printed circuit board at predetermined locations with normal orientation with respect to the board. The board is then folded in such a manner that the bodies of the components ar...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A method for increasing the packaging density of discrete electronic components. The components are mounted to a flexible printed circuit board at predetermined locations with normal orientation with respect to the board. The board is then folded in such a manner that the bodies of the components are mutually interleaved and are interleaved with other circuit components and terminals. A package with such interleaved components is also disclosed. |
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