Receptacle terminal for printed circuit board

Stamped and formed terminal receptacle for a printed circuit board comprises a hollow tubular receptacle portion, a transition portion, and a mounting portion. The tubular receptacle portion has a lead-receiving upper end and contains a hairpin type spring which extends downwardly from one wall of the receptacle and is reversely bent so that it extends upwardly toward the lead-receiving end. The tip of this spring is formed laterally of the axis of the receptacle to provide an inclined lead-in surface for the lead. The transition portion has features which prevent the flow of solder into the receptacle portion during soldering and the mounting portion has improved means for holding the terminal in the hole on the printed circuit board during handling prior to wave soldering.