Low profile DIP receptacle

A low profile DIP socket comprising a block-shaped housing with two parallel rows of box-like contact retaining cavities therein and with a rib extending from the inner side wall of each cavity. A DIP lead retaining contact is retained in each cavity and has a generally U-shaped configuration with a first of the two free ended legs having an extension on the free end thereof which is bent back into the channel of said "U" and towards and adjacent to said second leg. A tab is sheared from the bottom of the U-shaped contact and also the first leg thereof to form a slot in said bottom and said first leg thereof and into which said rib fits to orient and stabilize said contact. The tab extends from the closed end of the second leg and through an aperture in the bottom of the cavity in the housing for wire wrapping or other type connection purposes.