Method of manufacturing keyswitch assemblies

A keyswitch assembly including a circuit board having a plurality of circuits, each circuit terminating with a pair of first and second contacts, and a curved, resilient contact plate associated with each pair of contacts having at least a portion of its periphery in communication with one of the pair of contacts, the plate being selectively deflectable so that it communicates with the other contact to close the respective circuit. The contact plates are fixed in position by a retaining element comprising a film formed by a layer of thermoplastic material bonded to a flexible sheet of insulative material, the thermoplastic material being bonded to the resilient plates and circuit board thereby maintaining the former in correct position relative to the latter. The method of manufacturing the assembly includes precisely locating the plates over the pairs of contacts, placing the retaining element over the circuit board an applying pressure to the assembly at an elevated temperature for a predetermined time.