Insulated wire splice machine

Apparatus for assembling post insulated wire splices, each assembled splice having first a connector crimped around the wires and next insulation therearound, comprises wire gripper means to retain wires to be spliced in a fixed splice working position, connector forming means for crimping a connector around the wires, and connector feed means to supply a connector to the connector forming means. The connector forming means is movable between a position remote from the splice working position and a crimping position in which the forming means crimps a connector around the wires retained by the wire gripper means in the splice working position. The apparatus further comprises insulation assembly means for assembling insulation around the connector, and insulation feed means to provide insulation to the insulation assembly means. The insulation assembly means is movable between a position remote from the splice working position and an operating position in the splice working position.