Functional alloy for use in automated soldering processes
A solder alloy for use in automated soldering of workpieces by application thereto of liquid solder from a molten reservoir. The alloy consists essentially of from about 50 to 57.5% by weight tin, from about 1.5 to 4% by weight antimony, with the balance being substantially lead. The alloy is prefer...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A solder alloy for use in automated soldering of workpieces by application thereto of liquid solder from a molten reservoir. The alloy consists essentially of from about 50 to 57.5% by weight tin, from about 1.5 to 4% by weight antimony, with the balance being substantially lead. The alloy is preferably further characterized in displaying a solidus-to-liquidus temperature range no greater than that of a 60/40 weight ratio tin/lead solder. |
---|