Electroformed hermetic glass-metal seal

Electroformed hermetic glass-metal seal

Disclosed is an improved method of bonding two glass-like structures or a glass-like and a metallic structure, and an improved bond which may be fabricated by this method. In the preferred embodiment, the mating surfaces are first metalized with a thin titanium layer, which is covered by a thin gold...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ROTHENBERG, HOWARD S
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:Disclosed is an improved method of bonding two glass-like structures or a glass-like and a metallic structure, and an improved bond which may be fabricated by this method. In the preferred embodiment, the mating surfaces are first metalized with a thin titanium layer, which is covered by a thin gold layer. The metalized surfaces are joined, and a gold layer is electro-deposited over the junction in an overlapping fashion. Finally a nickel layer is electro-deposited over the gold layer.