Semiconductor structure with bumps and method for making the same
Semiconductor structure having a semiconductor body with a planar surface and with metallic contact pads formed over the surface. A layer of insulating material is formed over the contact pads. Bumps or pillars are formed which extend through the layer of insulating material and are bonded to the co...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | Semiconductor structure having a semiconductor body with a planar surface and with metallic contact pads formed over the surface. A layer of insulating material is formed over the contact pads. Bumps or pillars are formed which extend through the layer of insulating material and are bonded to the contact pads. The bumps or pillars are formed of a relatively ductile aluminum layer. A base portion is secured to the ductile layer and has a mushroom-shaped configuration. Gold-tin layers are carried by the base and form a gold-tin system so that the bumps or pillars can be readily bonded to the lead frames. |
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