METHOD AND APPARATUS FOR BONDING IN MINIATURIZED ELECTRICAL CIRCUITS

An improved method and apparatus for using adhesives to bond one element to another in miniature electronic circuitry is provided by rotating a tool head to bring first an adhesive dispensing opening into line with the work place and then a suction opening into that line. The head is moved to move t...

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Bibliographische Detailangaben
1. Verfasser:	MILLER C,US
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	An improved method and apparatus for using adhesives to bond one element to another in miniature electronic circuitry is provided by rotating a tool head to bring first an adhesive dispensing opening into line with the work place and then a suction opening into that line. The head is moved to move the openings in that line toward and away from the work place. A dot of adhesive is deposited while the adhesive dispensing opening is adjacent the work place and the element to be added is released to the adhesive by releasing suction while the suction opening is adjacent the dot of adhesive.