ELECTROLESS PLATING APPARATUS

Method and apparatus for concomitant particulate deposition in electroless plating, and the product thereof, wherein objects to be plated are subjected to tumbling during the plating process.

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Bibliographische Detailangaben
Hauptverfasser:	FLYNN W,US, INSKEEP J,US, MCCAULEY H,US, CHRISTINI T,US
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Method and apparatus for concomitant particulate deposition in electroless plating, and the product thereof, wherein objects to be plated are subjected to tumbling during the plating process.