METHOD OF DIVIDING MG-AL SPINEL SUBSTRATE WAFERS COATED WITH SEMICONDUCTOR MATERIAL AND PROVIDED WITH SEMICONDUCTOR COMPONENTS

METHOD OF DIVIDING MG-AL SPINEL SUBSTRATE WAFERS COATED WITH SEMICONDUCTOR MATERIAL AND PROVIDED WITH SEMICONDUCTOR COMPONENTS

Process of dividing a plurality of semiconductor components on a Mg-Al spinel substrate, coated with semiconductor material. The process comprises providing the spinel substrate wafer, prior to the production of the individual semiconductor elements, with a marking which indicates the directions, pr...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: FALCKENBERG R,DT
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Process of dividing a plurality of semiconductor components on a Mg-Al spinel substrate, coated with semiconductor material. The process comprises providing the spinel substrate wafer, prior to the production of the individual semiconductor elements, with a marking which indicates the directions, producing the semiconductor elements so that their boundaries are parallel to the marked directions, scoring and mechanically dividing the entire substrate wafer into individual components along these lines.