BACKPLANE MANUFACTURE

A method is described for manufacturing a backplane in which plugs are inserted into apertures in the backplane to mask the surfaces of the apertures. A nonconductive coating is formed on the backplane while the plugs are positioned in such apertures. Thereafter, electrical contacts are inserted int...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ANHALT J,US, GOODMAN D,US
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	A method is described for manufacturing a backplane in which plugs are inserted into apertures in the backplane to mask the surfaces of the apertures. A nonconductive coating is formed on the backplane while the plugs are positioned in such apertures. Thereafter, electrical contacts are inserted into the apertures to remove the plugs therefrom.