PRODUCT AND PROCESS FOR CAVITY METALLIZATION OF SEMICONDUCTOR PACKAGES

PRODUCT AND PROCESS FOR CAVITY METALLIZATION OF SEMICONDUCTOR PACKAGES

A process and composition are provided for the gold metallization of the bottoms of cavities in semiconductor packages wherein the walls of such cavities are left free from gold which might otherwise create short circuits between the face of the package and the bottom of the cavity. Semiconductor pa...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ROBSON W,US, BUDD J,US
Format: Patent
Sprache:eng
Schlagworte:
ARTIFICIAL STONE
BASIC ELECTRIC ELEMENTS
CEMENTS
CERAMICS
CHEMISTRY
COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS
CONCRETE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LIME, MAGNESIA
METALLURGY
REFRACTORIES
SEMICONDUCTOR DEVICES
SLAG
TREATMENT OF NATURAL STONE
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Beschreibung
Zusammenfassung:A process and composition are provided for the gold metallization of the bottoms of cavities in semiconductor packages wherein the walls of such cavities are left free from gold which might otherwise create short circuits between the face of the package and the bottom of the cavity. Semiconductor packages provided by the use of this process are different from and preferred over packages produced by their prior methods.