METHOD OF MANUFACTURING INTEGRATED CIRCUITS

In the manufacture of a pattern of an integrated circuit, a reference mark is detected by an electron beam scan to correctly determine the position of the pattern on each semiconductor chip, or to correctly combine the patterns of circuit elements. The reference mark may also be used to locate defec...

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Bibliographische Detailangaben
Hauptverfasser:	KOMIMIYA Y,JA, DENDA S,JA, TARUI Y,JA, BABA H,JA
Format:	Patent
Sprache:	eng
Schlagworte:	APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBEMICROSCOPY [SPM] BASIC ELECTRIC ELEMENTS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING PHYSICS SCANNING-PROBE TECHNIQUES OR APPARATUS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	In the manufacture of a pattern of an integrated circuit, a reference mark is detected by an electron beam scan to correctly determine the position of the pattern on each semiconductor chip, or to correctly combine the patterns of circuit elements. The reference mark may also be used to locate defects of the semiconductor material so as to avoid defective regions.