ADHESIVE COMPOSITION AND METHOD OF PREPARATION

A process for the production of an aqueous emulsion of an ethylene-vinyl acetate polymer is disclosed wherein the polymerization is performed in the presence of a preformed seed emulsion, from 1.5 to 6 weight percent of a protective colloid comprising a mixture of fully and partially hydrolyzed polyvinyl acetate and a minor amount, from 0.01 to 1 weight percent, of an unsaturated acid having from three to six carbon atoms. The seed emulsion is comprised of an aqueous emulsion containing from 25 to 63 weight percent of ethylene-vinyl acetate copolymers having an ethylene content between about 5 and 20 weight percent and from 2 to 6 weight percent of a partially hydrolyzed polyvinyl acetate. The polymerization is performed under an ethylene pressure of from 100 to 1000 psig., sufficient to incorporate from 5 to 20 weight percent ethylene in the final copolymer product and carried out until the total free monomer content of the emulsion is maintained below about 1 weight percent. Conventional free radical initiation of the polymerization reaction is used. The resultant emulsion can be used as an adhesive since films formed therefrom exhibit a high degree of adhesiveness.