METHOD FOR EMPLACING FILAMENT-SHAPED MATERIALS INTO THERMOPLASTIC MATERIALS AND PRODUCTS PRODUCED THEREBY

Apparatus and techniques for inlaying or emplacing filament-shaped materials such as wires or the like into a thermoplastic base material wherein the thermoplastic base material is heated to locally and temporarily soften the same following which the filament-shaped material is impressed thereinto. The apparatus includes a distributor having guide means thereon which receives the filament-shaped material from a source of the same, the lower portion of the guide means defining a sliding foot which is heated to soften the base material immediately before impressing the same with the filament-shaped material. The distributor is positioned at an angle with respect to the upper surface of the base material, the inclination of which may be adjusted to maintain the sliding foot portion in alignment with an axis of rotation about which the distributor may be turned 180 degrees for reverse movement of the apparatus. The base material is supported in a manner whereby it may be offset step-wise on reversal of the distributor. Sensing means are provided to automatically raise and lower the sliding foot portion of the distributor in response to changes in the level of the upper surface of the base portion. The distributor may be lifted and latched in a position spaced from the base material during temporary interruptions in emplacing the filament-shaped material into the base material.