METAL CONTACT AND INTERCONNECTION SYSTEM FOR NONHERMETIC ENCLOSED SEMICONDUCTOR DEVICES

Disclosed is a molybdenum-modifying metal ohmic contact and electrical interconnection system for semiconductor devices that are subjected to corrosive environments. A contact and interconnection system is formed using a layer composed of a mixture of molybdenum and a modifier metal, such as titaniu...

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Bibliographische Detailangaben
Hauptverfasser:	CUNNINGHAM J,US, FULLER C,US
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	Disclosed is a molybdenum-modifying metal ohmic contact and electrical interconnection system for semiconductor devices that are subjected to corrosive environments. A contact and interconnection system is formed using a layer composed of a mixture of molybdenum and a modifier metal, such as titanium, the system having the desired characteristics of the molybdenum system but with greatly increased corrosion resistance which allows devices using such a system to be mounted in nonhermetic packages.