ALIMINUM PLATING PROCESS

Aluminum plating according to which aluminum film formed has no cracks and pin-holes on its surface, a uniform thickness, excellent luster and is strongly bonded to the substrate can be attained by heat treating a substrate covered with aluminum at 400 DEG C the melting point of aluminum for 10 seco...

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Bibliographische Detailangaben
Hauptverfasser:	INOUE Y,JA, IIDA K,JA, KONDO Y,JA, ICHIKI E,JA
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Aluminum plating according to which aluminum film formed has no cracks and pin-holes on its surface, a uniform thickness, excellent luster and is strongly bonded to the substrate can be attained by heat treating a substrate covered with aluminum at 400 DEG C the melting point of aluminum for 10 seconds 30 minutes in an inert atmosphere said heat treatment being preceded by or followed by treating of the covered substrate with a surface treating agent comprising active hydrogen-containing compound, oxygen or halogen and thereafter taking out thus treated substrate into the air.