PANEL BOARD SYSTEMS AND COMPONENTS THEREFOR

A panel board system particularly adapted for mounting high speed integrated circuit devices is shown to include integrated circuit packages, connectors and panel board means which each incorporate impedance matching means to provide for complete integrity of the system. The integrated circuit packages have an integrated circuit chip mounted on one side of a ceramic card and have the chip electrically connected to a plurality of printed circuit paths formed on the saem side of the card. These circuit paths terminate in closely spaced relation to each other along one edge of the card and a metal ground plane is formed on the opposite side of the card to provide controlled impedance in the integrated circuit package. Each connector receives an edge of an integrated circuit package and has a plurality of contact means located in closely spaced relation to each other along one side of a dielectric member within the connector for detachably engaging respective circuit path terminations on the integrated circuit package. A metal ground plane formed on the opposite side of this dielectric member provides matching impedance within the connector. Preferably the connector has additional contact means mounted on the ground plane within the connector for detachably engaging the ground plane on the integrated circuit package. Terminal portions of the connector contact means extend from the connector into the panel board, preferably in staggered relation to each other, to be electrically connected to impedance matched circuit path and ground plane means on the panel board, the staggered relationship of the contact terminal portions facilitating electrical connection of the terminal portions to the circuit path and ground plane means of the panel board when connectors are mounted with high density on the panel board.