ELECTROLESS COPPER PLATING

An improved aqueous autocatalytic copper deposition solution is provided which comprises maintaining in a solution, containing complexing and reducing agents for the copper ion and a pH adjuster, a small effective amount of a compound providing a metal value selected from the group consisting of mol...

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Bibliographische Detailangaben
Hauptverfasser:	JOHN DUFF WILLIAMSON, FREDERICK W. SCHNEBLE JR, RUDOLPH J. ZEBLISKY, JOHN F. MCCORMACK
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	An improved aqueous autocatalytic copper deposition solution is provided which comprises maintaining in a solution, containing complexing and reducing agents for the copper ion and a pH adjuster, a small effective amount of a compound providing a metal value selected from the group consisting of molybdenum, niobium, tungsten, rhenium, rare earths of the actinide series, rare earths of the lanthanide series, and mixtures of the foregoing. Additionally, an improved method of depositing electroless copper is provided which comprises employing the solution hereinabove defined.