APPARATUS FOR CHEMICALLY ETCHING SURFACES

An apparatus for chemically etching a substantially flat surface of a workpiece such as a semiconductor wafer comprises a vessel containing a fluid etchant, means for producing a toroidal turbulence in the etchant, and a substantially circular, inverted, conical deflecting surface around the workpie...

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Bibliographische Detailangaben
Hauptverfasser: WILLIAM NELSON HENRY, RAYMOND ARTHUR ALLEMAN
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An apparatus for chemically etching a substantially flat surface of a workpiece such as a semiconductor wafer comprises a vessel containing a fluid etchant, means for producing a toroidal turbulence in the etchant, and a substantially circular, inverted, conical deflecting surface around the workpiece for deflecting falling fluid from the peripheral region of the toroidal turbulence toward the workpiece surface. The central axes of the toroidal turbulence, and the deflecting surface coincide.