Adhesive compositions

An adhesive composition comprises a resin base portion, a hardener portion and a finely divided inert filler, the resin base portion comprising an epoxide resin and a polystyrene resin, the hardener portion comprising a polyamido-amine which is the reaction product of a polycarboxylic acid and a pol...

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1. Verfasser: WAGNER HERMAN B
Format: Patent
Sprache:eng
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Zusammenfassung:An adhesive composition comprises a resin base portion, a hardener portion and a finely divided inert filler, the resin base portion comprising an epoxide resin and a polystyrene resin, the hardener portion comprising a polyamido-amine which is the reaction product of a polycarboxylic acid and a polyamine, and uncombined polyamine, the inert filler being incorporated in the hardener portion and/or the resin base portion. In a preferred embodiment, phenyl glycidyl ether, 2: 21 - bis - (hydroxyphenyl) propane and petroleum jelly are also present in the resin base portion. Specified polyepoxides are epoxidized glycerol disleate, 1: 4 - bis - (2: 3 - epoxypropoxy) benzene, 1: 3-bis - (2: 3 - epoxypropoxy) benzene, 4: 41-bis - (2: 3 - epoxypropoxy) diphenyl ether, 1: 8 - bis - (2: 3 - epoxypropoxy) octane, 1: 4-bis - (2: 3 - epoxypropoxy) cyclohexane, 4: 41-bis - (2 - hydroxy - 3: 4 - epoxybutoxy) diphenyl dimethyl methane, 1: 3 - bis - (4: 5-epoxypentoxy) - 5 - chlorobenzene, 1: 4 - bis - (3: 4 - epoxybutoxy) - 2 - chlorocyclohexane, 1: 3 - bis - (2 - hydroxy - 3: 4 - epoxybutoxy)-benzene, 1: 4 - bis - (2 - hydroxy - 4: 5 : epoxypentoxy) benzene and reaction products of 3 - chloro - 1: 2 - epoxy butane, 3 - bromo - 1: 2-epoxy hexane, 3 - chloro - 1: 2 - epoxyoctane or epichlorhydrin with resorcinol, catechol hydroquinone, methyl resorcinol, bis-phenol-A-2: 2 - (4 - hydroxyphenyl) butane, 4: 41, dihydroxybenzophenone, bis - (BETA - hydroxyphenyl) ethane, 2: 2 - bis - (4 - hydroxyphenyl, pentane and 1: 5-dihydroxynaphthalene. Specified polyamides are those derived from ethylene diamine, propylene diamine, diethylene triamine, dipropylene triamine, triethylene tetramine, tripropylene tetramine, tetraethylene pentamine or tetrapropylene pentamine and adipic, pimelic, suberic, azelaic, sebacic, nonane dicarboxylic, citraconic, mesaconic, itaconic and diterpene acids. Specified solvents for solid epoxides are phenyl glycidyl ether, acetone, methyl ethyl ketone, isophorone ethyl acetate, butyl acetate and the methyl, ethyl or butyl ether of ethylene glycol.