Epoxy molding composition and method of molding with same

The curing of epoxy resins produced, e.g. as described in Specifications 680,997 and 681,578 in presence of p,p1-diaminodiphenylmethane is accelerated by the addition of phenol, catechol, resorcinol or cresol. Proportions used are from 0.5 to 30% of diamine on the weight of the epoxy compound and up to 10% on the combined weight of epoxy compound and diamine of the phenol. Fillers specified are titanium dioxide, acetylene black, glass fibres, asbestos, silica, perlite, biotite or mica, chrome yellow, zinc oxide, walnut shell, wood flour, nylon fibres. When 2-40% acetylene black is used in the composition electrically conducting mouldings may be obtained. A suitable base composition to which (1) 9, or (2) 22.5, or (3) 45 parts catechol, or (4) 22.5 parts resorcinol are added comprises 270 parts epoxy resin No. 1, 100 parts epoxy resin No. 2, 60 parts p diamino diphenyl methane, 500 parts silica flour, 115 parts nylon fibres, 50 parts TiO2 and 4.5 parts fatty ester. The physical properties of mouldings made according to the invention are compound with similar mouldings made without accelerators. Specification 629,111 also is referred to.