RESIN LAMINATE FOR PACKAGING MATERIAL

An object of the invention is to provide a resin laminate for packaging material containing a base layer and a sealant layer, each of which contains the same material with high processability. The resin laminate for packaging material contains at least a base layer and a sealant layer, wherein each...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TAGA, Atsushi, TANEKI, Kensuke, IMAI, Toru, HAMANO, Akito
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An object of the invention is to provide a resin laminate for packaging material containing a base layer and a sealant layer, each of which contains the same material with high processability. The resin laminate for packaging material contains at least a base layer and a sealant layer, wherein each of resin compositions for the base layer and the sealant layer contains the same resin (A) as a main component, the base layer has a fusion initiation temperature (FIT-B), and the sealant layer has a sealing initiation temperature (SIT-S), wherein the temperatures satisfy the following inequalities of from (1) to (3):50° C.≤(FIT-B)−(SIT-S)≤90° C.   Inequality (1)90° C.≤(SIT-S)≤120° C.   Inequality (2)160° C.≤(FIT-B)≤180° C.   Inequality (3).