Stacked Multi-Gate Device With Reduced Contact Resistance And Methods For Forming The Same

Method to form low-contact-resistance contacts to source/drain features are provided. A method of the present disclosure includes receiving a workpiece including an opening that exposes a surface of an n-type source/drain feature and a surface of a p-type source/drain feature, selectively depositing...

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Bibliographische Detailangaben
Hauptverfasser: Chang, Po-Chin, Lee, Olivia Pei-Hua, Yang, Ku-Feng, Liao, Szuya, Hu, Kuan-Kan, Wang, Sung-Li
Format: Patent
Sprache:eng
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Zusammenfassung:Method to form low-contact-resistance contacts to source/drain features are provided. A method of the present disclosure includes receiving a workpiece including an opening that exposes a surface of an n-type source/drain feature and a surface of a p-type source/drain feature, selectively depositing a first silicide layer on the surface of the p-type source/drain feature while the surface of the n-type source/drain feature is substantially free of the first silicide layer, depositing a metal layer on the first silicide layer and the surface of the n-type source/drain feature, and depositing a second silicide layer over the metal layer. The selectively depositing includes passivating the surface of the surface of the n-type source/drain features with a self-assembly layer, selectively depositing the first silicide layer on the surface of the p-type source/drain feature, and removing the self-assembly layer.