FLUX AND SOLDER PASTE COMPRISING SAID FLUX
A flux consisting of, (i) 30 to 80 wt. % of one or more acidic resins, (ii) 10 to 60 wt. % of at least one organic solvent, (iii) 0 to 15 wt. % of one or more amines, and (iv) 0 to 20 wt. % of one or more components other than components (i) to (iii), wherein the flux undergoes a weight loss of ≥50...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A flux consisting of, (i) 30 to 80 wt. % of one or more acidic resins, (ii) 10 to 60 wt. % of at least one organic solvent, (iii) 0 to 15 wt. % of one or more amines, and (iv) 0 to 20 wt. % of one or more components other than components (i) to (iii), wherein the flux undergoes a weight loss of ≥50 wt. % upon reaching a temperature of 280° C. during a thermogravimetric analysis carried out in the range from 25 to 350° C. at a heating rate of 10 K/min and with the addition of synthetic air; and solder paste consisting of 80 to 92 wt. % of one or more different solders and 8 to 20 wt. % of the flux. |
---|