DEVICES, SYSTEMS, AND METHODS OF A CUTTING ELEMENT IN A BIT

DEVICES, SYSTEMS, AND METHODS OF A CUTTING ELEMENT IN A BIT

A cutting element may include a substrate having a base. A cutting element may include an ultrahard layer bonded to the substrate, the ultrahard layer formed from an ultrahard material, the ultrahard layer including: a side surface adjacent to the base, the side surface including a plurality of cutt...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Zhang, Youhe, Gan, Xiaoge, Song, Huimin, Mushinski, Ryan, Durairajan, Balasubramanian
Format: Patent
Sprache:eng
Schlagworte:
EARTH DRILLING
EARTH DRILLING, e.g. DEEP DRILLING
FIXED CONSTRUCTIONS
MINING
OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR ASLURRY OF MINERALS FROM WELLS
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Zusammenfassung:A cutting element may include a substrate having a base. A cutting element may include an ultrahard layer bonded to the substrate, the ultrahard layer formed from an ultrahard material, the ultrahard layer including: a side surface adjacent to the base, the side surface including a plurality of cutting surfaces; and an upper surface extending into the ultrahard layer.