PACKAGE WITH CLIP DIRECTLY CONNECTED TO OBLONG ELECTRIC CONNECTION ELEMENT EXTENDING ALONG MOUNTING BASE

PACKAGE WITH CLIP DIRECTLY CONNECTED TO OBLONG ELECTRIC CONNECTION ELEMENT EXTENDING ALONG MOUNTING BASE

A package and electronic device are disclosed. In one example, the electronic device comprises a mounting base, an oblong electric connection element, and a package mounted on the mounting base and comprising a carrier, electronic components mounted on the carrier, and an encapsulant at least partia...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KELKAR, Kapil, MORAGHEBI, Homayoun, NAEVE, Tomasz
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A package and electronic device are disclosed. In one example, the electronic device comprises a mounting base, an oblong electric connection element, and a package mounted on the mounting base and comprising a carrier, electronic components mounted on the carrier, and an encapsulant at least partially encapsulating the carrier and the electronic components. A clip is connected to upper main surfaces of the electronic components. The encapsulant partially encapsulates the clip so that an exposed surface of the clip is directly electrically connected with the oblong electric connection element extending along the mounting base.