INTERPOSER STITCH THROUGH A TOP CHIPLET

Embodiments herein describe devices that include an interposer with a stitch formed from overlapping exposure areas, which may result in the interposer having a total surface area that is greater than a maximum reticle field corresponding to the exposure areas. Two or more integrated circuits (e.g., chiplets) can be disposed on the interposer. At least one of the integrated circuits is disposed over the stitch. The interposer can provide chip-to-chip connections between the integrated circuits.