SEMICONDUCTOR DEVICE
A semiconductor device includes: a semiconductor element including a plurality of electrodes; a first lead including a first pad portion and a first terminal portion; a second lead including a second pad portion and a second terminal portion; a plurality of wires; and a sealing resin. Each of the wi...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A semiconductor device includes: a semiconductor element including a plurality of electrodes; a first lead including a first pad portion and a first terminal portion; a second lead including a second pad portion and a second terminal portion; a plurality of wires; and a sealing resin. Each of the wires is electrically bonded to one of the plurality of electrodes and to one of the first pad portion and the second pad portion. As viewed in a third direction, a length of a straight line connecting a center of the first pad portion and a center of the second pad portion is defined as a first section length. As viewed in the third direction, a length of a straight line connecting a center of the first terminal portion and a center of the second terminal portion is defined as a second section length. The second section length is different from the first section length. |
---|