SEMICONDUCTOR MEMORY MODULE INCLUDING FIXING STRUCTURE

A semiconductor memory module is disclosed. The semiconductor memory module includes a first substrate including a first corner, first semiconductor packages mounted on a lower surface of the first substrate, a second substrate disposed over the first substrate and including a second corner correspo...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHOI, DEOK-SEON, RHEW, KEUN-HO, NOH, Hyunggyun, BAE, JINSOO, CHOE, Jongchan
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A semiconductor memory module is disclosed. The semiconductor memory module includes a first substrate including a first corner, first semiconductor packages mounted on a lower surface of the first substrate, a second substrate disposed over the first substrate and including a second corner corresponding to the first corner, second semiconductor packages mounted on an upper surface of the second substrate, and a fixing structure in which the first corner and the second corner are fitted.