PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APPARATUS

In the printed circuit board, normal pads that are not peeled off or damaged are first pads, Each first pad and a wire connected to the first pad have an integrated structure and are directly formed on a substrate. After a pad at a position on the substrate is peeled off, a second pad can be provide...

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Bibliographische Detailangaben
Hauptverfasser:	FENG, Tian, TONG, Yuhao, FAN, Zhicheng, XIE, Haihai, HE, Guangchao, ZHANG, Jie, MAO, Qining
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	In the printed circuit board, normal pads that are not peeled off or damaged are first pads, Each first pad and a wire connected to the first pad have an integrated structure and are directly formed on a substrate. After a pad at a position on the substrate is peeled off, a second pad can be provided at the position, so as to replace the pad that was peeled off. The second pad comes into contact with the wire and is fixed to the wire by solder. The first pin of a component is lapped with the first pad and is fixed with the first pad by solder. The second pin of the component is lapped with the second pad and is fixed with the second pad by solder.